Flecto Floating Connectors

Flecto Floating Connectors

Features:
  • Movement in the X, Y, Z axes before and during mating to allow for multiple connections between two PCBs.
  • Up to 12GHz / 12Gbps data rate.
  • FLECTO signal-only connectors feature location pegs to eliminate movement during solder reflow. These are augmented with retention tabs to provide additional mechanical strength for surface mount connectors.
  • On the mixed signal and power connectors, through-board solderable posts are provided for both location accuracy and enhanced mechanical strength. The latter ensures resistance to shocks as high as 50G.
  • A number of the connectors in the family feature shrouded contacts to prevent accidental damage when no mating connector is present, while others offer polarization within the shroud to ensure mating is only possible in one direction.
  • Supports automated assembly with its Tape and Reel Packaging.
Applications:
  • Electric Vehicles
    • Infotainment Systems
    • Inverter Units
    • Battery Management Systems
    • LIDAR
  • Smart Factory
    • Factory Automation
    • Drives and Controls
    • Robotics
    • Sensor Units
    • Vision Systems
  • Embedded Systems
    • Datacoms
    • Home automation
    • Medical Devices
    • Transit Systems
Variations:

Consists of five series with three pitch options and floating mechanism is included in the male connector.

  • F10 series: 0.50mm (.0197″) pitch, all signal
  • F11 series: 0.5mm (.0197″) pitch, signal + power
  • F12 series: 0.5mm (.0197) pitch, all signal
  • F20 series = 0.635mm (.25″) pitch, all signal
  • F30 series = 0.80mm (.315″) pitch, all signal
Summary:

Interconnect is an integral and important aspect of every electronic design. Board-to-board connectors can allow designers to follow a modular design path, separating key elements of a system. This facilitates re-use across other designs, shortening time-to-market and reducing design risk. Additionally, these connectors support the development of compact, multi-board solutions that allow for small form-factor designs able to fit into space-constrained environments.

However, the increased demand for multiple connectors per board pair increases the possibility of potential misalignment during automated pick-and-place and solder reflow processes. This, in turn, can lead to manufacturing quality issues if the connectors experience unintended strain. In addition, once the systems are in the field, these stresses may be exacerbated by additional stresses resulting from short-term or long-term exposure to shock, vibration or changes in temperature. By accommodating and absorbing misalignments and small movements in multiple axes, floating board-to-board connectors such Harwin’s new FLECTO range allow OEMs to deploy automated manufacturing techniques for PCBs featuring multiple connectors without compromising data performance and power transfer capabilities.

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